Testing for Small-Delay Defects in Nanoscale CMOS Integrated Circuits: Devices, Circuits, and Systems
Editat de Sandeep K. Goel, Krishnendu Chakrabartyen Limba Engleză Hardback – 25 oct 2013
- Overviews semiconductor industry test challenges and the need for SDD testing, including basic concepts and introductory material
- Describes algorithmic solutions incorporated in commercial tools from Mentor Graphics
- Reviews SDD testing based on "alternative methods" that explores new metrics, top-off ATPG, and circuit topology-based solutions
- Highlights the advantages and disadvantages of a diverse set of metrics, and identifies scope for improvement
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Specificații
ISBN-13: 9781439829417
ISBN-10: 1439829411
Pagini: 259
Ilustrații: 90 b/w images
Dimensiuni: 156 x 234 x 22 mm
Greutate: 0.59 kg
Ediția:1
Editura: CRC Press
Colecția CRC Press
Seria Devices, Circuits, and Systems
ISBN-10: 1439829411
Pagini: 259
Ilustrații: 90 b/w images
Dimensiuni: 156 x 234 x 22 mm
Greutate: 0.59 kg
Ediția:1
Editura: CRC Press
Colecția CRC Press
Seria Devices, Circuits, and Systems
Public țintă
Graduate students in electrical and computer engineering, as well as academic and industrial researchers in small delay fault testing and quality ilnprovement. Engineers in the semiconductor industry who deal with real-chip design and manufacture.Cuprins
Fundamentals of Small-Delay Defect Testing. Timing-Aware ATPG: K Longest Paths. Timing-Aware ATPG. Faster-than-At-Speed: Faster-than-at-Speed Test for Screening Small-Delay Defects. Circuit Path Grading Considering Layout, Process Variations, and Cross Talk. Alternative Methods: Output Deviations-Based SDD Testing. Hybrid/Top-off Test Pattern Generation Schemes for Small-Delay Defects. Circuit Topology-Based Test Pattern Generation for Small-Delay Defects. SDD Metrics: Small-Delay Defect Coverage Metrics. Conclusion. References.
Notă biografică
Sandeep Kumar Goel is a Senior Manager (DFT/3D-Test) with Taiwan Semiconductor Manufacturing Company (TSMC), San Jose, CA. He received his Ph.D. degree from the University of Twente, The Netherlands. Prior to TSMC, he was in various research and management positions with LSI Corporation CA, Magma Design Automation, CA, and Philips Research, The Netherlands. He has co-authored two books, three book chapters, and published over 80 papers in journals and conference/workshop proceedings. He has delivered several invited talks and has been panelist at several conferences. He holds 15 U.S. and 5 European patents and has over 30 other patents pending. His current research interests include all topics in the domain of testing, diagnosis and failure analysis of 2D/3D chips. Dr. Goel was a recipient of the Most Significant Paper Award at the IEEE International Test Conference in 2010. He serves on various conference committees including DATE, ETS, ITC, DATA, and 3DTest. He was the General Chair of 3D Workshop at DATE 2012. He is a senior member of the IEEE.
Krishnendu Chakrabarty received the B. Tech. degree from the Indian Institute of Technology, Kharagpur, in 1990, as well as M.S.E. and Ph.D. degrees from the University of Michigan, Ann Arbor, in 1992 and 1995, respectively. He is now Professor of Electrical and Computer Engineering at Duke University. He is also a Chair Professor of Software Theory in the School of Software, Tsinghua University, Beijing, China. Dr. Chakrabarty is a recipient of the National Science Foundation Early Faculty (CAREER) award, the Office of Naval Research Young Investigator award, the Humboldt Research Fellowship, and several best papers awards at IEEE conferences.
Krishnendu Chakrabarty received the B. Tech. degree from the Indian Institute of Technology, Kharagpur, in 1990, as well as M.S.E. and Ph.D. degrees from the University of Michigan, Ann Arbor, in 1992 and 1995, respectively. He is now Professor of Electrical and Computer Engineering at Duke University. He is also a Chair Professor of Software Theory in the School of Software, Tsinghua University, Beijing, China. Dr. Chakrabarty is a recipient of the National Science Foundation Early Faculty (CAREER) award, the Office of Naval Research Young Investigator award, the Humboldt Research Fellowship, and several best papers awards at IEEE conferences.
Descriere
Advances in design methods and process technologies are leading to a continuous increase in the complexity of integrated circuits (ICs). However, the increased complexity and nanometer-size features of modern ICs make them susceptible to manufacturing defects, as well as performance and quality issues. This book covers common problems in areas such as process variations, power supply noise, crosstalk, resistive opens/bridges, and design-for-manufacturing (DfM)-related rule violations. The book also addresses testing for small-delay defects (SDDs), which can cause timing failures on both critical and non-critical paths in the circuit.