Chemical Vapor Deposition of Tungsten and Tungsten Silicides for VLSI/ ULSI Applications
Autor John E.J. Schmitzen Limba Engleză Hardback – 30 dec 1992
Preț: 425.32 lei
Preț vechi: 552.37 lei
-23% Nou
Puncte Express: 638
Preț estimativ în valută:
81.40€ • 84.55$ • 67.61£
81.40€ • 84.55$ • 67.61£
Carte tipărită la comandă
Livrare economică 03-17 februarie 25
Preluare comenzi: 021 569.72.76
Specificații
ISBN-13: 9780815512882
ISBN-10: 0815512880
Pagini: 251
Dimensiuni: 152 x 229 x 18 mm
Greutate: 0.48 kg
Ediția:New.
Editura: ELSEVIER SCIENCE
ISBN-10: 0815512880
Pagini: 251
Dimensiuni: 152 x 229 x 18 mm
Greutate: 0.48 kg
Ediția:New.
Editura: ELSEVIER SCIENCE
Public țintă
Engineers and technologists in the semiconductor, optoelectronic, optics, cutting tool, refractory fibers, filter and other industries.Cuprins
Introduction
The Blanket Tungsten Approach
The Selective Tungsten Approach
Blanket Versus Selective Tungsten
Tungsten as Interconnect Material
The Chemistry of CVD-W and Properties of Tungsten
The Deposition Equipment
Miscellaneous
Chemical Vapor Deposition of Tungsten Silicide
References
Author Index
Subject Index
Appendix: Unit Cells of W and WSi2
The Blanket Tungsten Approach
The Selective Tungsten Approach
Blanket Versus Selective Tungsten
Tungsten as Interconnect Material
The Chemistry of CVD-W and Properties of Tungsten
The Deposition Equipment
Miscellaneous
Chemical Vapor Deposition of Tungsten Silicide
References
Author Index
Subject Index
Appendix: Unit Cells of W and WSi2
Recenzii
"After reading this book, an engineer should have all the necessary background." --European Semiconductor