VLSI Technology: Fundamentals and Applications: Springer Series in Electronics and Photonics, cartea 12
Editat de Yasuo Taruien Limba Engleză Paperback – 10 dec 2011
Din seria Springer Series in Electronics and Photonics
- Preț: 382.98 lei
- 15% Preț: 633.32 lei
- 15% Preț: 642.79 lei
- Preț: 384.47 lei
- Preț: 386.56 lei
- 15% Preț: 634.60 lei
- Preț: 382.59 lei
- Preț: 374.09 lei
- Preț: 377.69 lei
- Preț: 387.69 lei
- 15% Preț: 632.33 lei
- 18% Preț: 718.03 lei
- 18% Preț: 927.51 lei
- 15% Preț: 627.35 lei
- Preț: 384.10 lei
- 15% Preț: 630.23 lei
- 15% Preț: 626.72 lei
- Preț: 389.60 lei
- Preț: 388.49 lei
- Preț: 375.42 lei
- Preț: 388.86 lei
- 15% Preț: 635.42 lei
- 15% Preț: 622.68 lei
- Preț: 377.51 lei
- 15% Preț: 630.91 lei
- Preț: 385.42 lei
- Preț: 388.49 lei
- Preț: 383.93 lei
- 15% Preț: 630.74 lei
- 15% Preț: 631.37 lei
- 15% Preț: 631.37 lei
- 18% Preț: 938.52 lei
Preț: 637.81 lei
Preț vechi: 750.37 lei
-15% Nou
Puncte Express: 957
Preț estimativ în valută:
122.12€ • 127.16$ • 101.32£
122.12€ • 127.16$ • 101.32£
Carte tipărită la comandă
Livrare economică 14-28 februarie
Preluare comenzi: 021 569.72.76
Specificații
ISBN-13: 9783642691942
ISBN-10: 3642691943
Pagini: 468
Ilustrații: XIV, 450 p.
Dimensiuni: 155 x 235 x 25 mm
Greutate: 0.65 kg
Ediția:Softcover reprint of the original 1st ed. 1986
Editura: Springer Berlin, Heidelberg
Colecția Springer
Seria Springer Series in Electronics and Photonics
Locul publicării:Berlin, Heidelberg, Germany
ISBN-10: 3642691943
Pagini: 468
Ilustrații: XIV, 450 p.
Dimensiuni: 155 x 235 x 25 mm
Greutate: 0.65 kg
Ediția:Softcover reprint of the original 1st ed. 1986
Editura: Springer Berlin, Heidelberg
Colecția Springer
Seria Springer Series in Electronics and Photonics
Locul publicării:Berlin, Heidelberg, Germany
Public țintă
ResearchCuprins
1. lntroduction.- 1.1 The Significance of Semiconductor Integrated Circuits.- 1.2 Prospects of High-Density Integration.- 1.3 Device Dimensions and Density of Integration.- 1.4 Outline of the Microfabrication Technology.- 2. Electron Beam Lithography.- 2.1 Background.- 2.2 Components for Electron-Beam Lithography.- 2.3 Software for Electron-Beam Lithography.- 2.4 Wafer and Writing Systems.- 3. Pattern Replication Technology.- 3.1 UV Replication Technologies.- 3.2 Deep-UV Projection System.- 3.3 X-Ray Lithography.- 3.4 Electron-Beam Projection.- 3.5 Radiation-Sensitive Resist for Microfabrication.- 4. Mask Inspection Technology.- 4.1 Principles of Mask Inspection.- 4.2 Mask Inspection Systems.- 5. Crystal Technology.- 5.1 Overview.- 5.2 Impurities in Si Crystals.- 5.3 Wafer Bow and Warpage.- 5.4 Thermally Induced Microdefects.- 5.5 Epitaxial Growth.- 6. Process Technology.- 6.1 Dry Etching.- 6.2 Beam Annealing.- 6.3 Thin-Film Deposition Techniques.- 6.4 Metallization.- 6.5 Evaluation of Gate Oxide Film.- 6.6 Super Clean Environment.- 7. Fundamentals of Test and Evaluation.- 7.1 Testing and Evaluation of the Device Design.- 7.2 Device Analysis and Evaluation.- 7.3 Device Testing.- 8. Basic Device Technology.- 8.1 Background.- 8.2 Limitations for Miniaturization.- 8.3 Prediction of Device Performance Advancements.- 8.4 Examples of Device Structure.- 8.5 Device Structure.- References.