Coupled Data Communication Techniques for High-Performance and Low-Power Computing: Integrated Circuits and Systems
Editat de Ron Ho, Robert Drosten Limba Engleză Paperback – 5 sep 2012
Toate formatele și edițiile | Preț | Express |
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Paperback (1) | 941.05 lei 6-8 săpt. | |
Springer Us – 5 sep 2012 | 941.05 lei 6-8 săpt. | |
Hardback (1) | 947.04 lei 6-8 săpt. | |
Springer Us – 23 iun 2010 | 947.04 lei 6-8 săpt. |
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Specificații
ISBN-13: 9781461426172
ISBN-10: 1461426170
Pagini: 224
Ilustrații: XVI, 206 p. 183 illus.
Dimensiuni: 155 x 235 x 12 mm
Greutate: 0.32 kg
Ediția:2010
Editura: Springer Us
Colecția Springer
Seria Integrated Circuits and Systems
Locul publicării:New York, NY, United States
ISBN-10: 1461426170
Pagini: 224
Ilustrații: XVI, 206 p. 183 illus.
Dimensiuni: 155 x 235 x 12 mm
Greutate: 0.32 kg
Ediția:2010
Editura: Springer Us
Colecția Springer
Seria Integrated Circuits and Systems
Locul publicării:New York, NY, United States
Public țintă
ResearchCuprins
to Coupled Data Technologies.- Overview of 3D Technologies.- Power delivery, signaling and cooling for 2D and 3D integrated systems.- Coupled Data Technologies.- Capacitive Coupled Communication.- Inductive Coupled Communications.- Use of AC Coupled Interconnect in Contactless Packaging.- Enabling Coupled Data Technologies.- Aligning chips face-to-face for dense capacitive communication.- Extending Data Coupling Technologies.- Delivering On-chip Bandwidth Off-chip and Out-of-box with Proximity and Optical Communication.- AC Coupled Wireless Power Delivery.
Textul de pe ultima copertă
Designers of next-generation high-performance computer systems face a host of technical challenges. For the past several decades, rising clock frequencies and increased chip integration have fueled the growth of computer performance. Now these trends have slowed: power and complexity constrains further increases in clock frequencies, and economic realities limit the pace of Moore's Law. Coupled data communication provides a way forward, and this book, Coupled Data Communication Techniques for High-Performance and Low-Power Computing, gives a comprehensive overview for such coupled data techniques.Coupled data communication allows chips to communicate—capacitively or inductively—over short distances between chips without solder, and fundamentally shifts the design paradigm from single-chip integration to single-package integration. This book covers the state-of-the-art in the circuits, architectures, and chip packaging for this novel chip-to-chip communication technology and showcases its potential to drive the coming decades of industry growth.Coupled Data Communication Techniques for High-Performance and Low-Power Computing should be of interest to students and designers in circuits and system architecture.
Caracteristici
Serves as a collection of the best-known-methods and ideas from leaders in the field. Includes a carefully-selected set of discussions on the important issues, tradeoffs, and techniques in coupled data I/O. Provides an overview of the circuits, architectures, and chip packaging for coupled data techniques. Covers the new and emerging area of coupled data communication. Includes supplementary material: sn.pub/extras