Circuits and Systems for Future Generations of Wireless Communications: Integrated Circuits and Systems
Editat de Aleksandar Tasic, Wouter A. Serdijn, Gianluca Settien Limba Engleză Hardback – 2 iun 2009
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Specificații
ISBN-13: 9781402099182
ISBN-10: 1402099185
Pagini: 316
Ilustrații: VIII, 306 p.
Dimensiuni: 155 x 235 x 27 mm
Greutate: 0.62 kg
Ediția:2009
Editura: SPRINGER NETHERLANDS
Colecția Springer
Seria Integrated Circuits and Systems
Locul publicării:Dordrecht, Netherlands
ISBN-10: 1402099185
Pagini: 316
Ilustrații: VIII, 306 p.
Dimensiuni: 155 x 235 x 27 mm
Greutate: 0.62 kg
Ediția:2009
Editura: SPRINGER NETHERLANDS
Colecția Springer
Seria Integrated Circuits and Systems
Locul publicării:Dordrecht, Netherlands
Public țintă
ResearchCuprins
A Multimode Radio Transceiver for Cellular Applications.- Reconfigurable Multi-Band OFDM UWB Receivers: Circuits and System Considerations.- Low Power UWB Circuits: Front-End Building Blocks.- CMOS IR-UWB Transceiver System Design for Contact-Less Chip Testing Applications.- Multi-mode Power Amplifiers for Wireless Handset Applications.- Polyphase Multipath Circuits for Cognitive Radio and Flexible Multi-phase Clock Generation.- IIP2 Improvement Techniques for Multi-standard Mobile Radio.- Multi-standard Continuous-Time Sigma–Delta Converters for 4G Radios.- Power Efficient Reconfigurable Baseband Filters for Multimode Radios.- An Adaptive Digital Front-End for Multi-mode Wireless Receivers.- FEC Decoders for FutureWireless Devices: Scalability Issues and Multi-standard Capabilities.
Notă biografică
Aleksandar Tasic: Qualcomm Incorporated, San Diego, California, USA, atasic@qualcomm.com
Wouter A. Serdijn: Department of Microelectronics, Electronics Research Laboratory, Delft University of Technology, Delft, the Netherlands, w.a.serdijn@tudelft.nl
Lawrence E. Larson: Radio Frequency Integrated Circuits Group University of California San Diego, La Jolla, CA, USA, larson@ece.ucsd.edu
Gianluca Setti: Department of Engineering (ENDIF), University of Ferrara Advanced Research Center on Electronic Systems (ARCES), University of Bologna, gianluca.setti@unife.it
Wouter A. Serdijn: Department of Microelectronics, Electronics Research Laboratory, Delft University of Technology, Delft, the Netherlands, w.a.serdijn@tudelft.nl
Lawrence E. Larson: Radio Frequency Integrated Circuits Group University of California San Diego, La Jolla, CA, USA, larson@ece.ucsd.edu
Gianluca Setti: Department of Engineering (ENDIF), University of Ferrara Advanced Research Center on Electronic Systems (ARCES), University of Bologna, gianluca.setti@unife.it
Textul de pe ultima copertă
The explosive demand in wireless-capable devices, especially with the proliferation of multiple standards, indicates a great opportunity for adoption of wireless technology at a mass-market level. The communication devices of both today and the future will have not only to allow for a variety of applications, supporting the transfer of characters, audio, graphics, and video data, but they will also have to maintain connection with many other devices rather than with a single base station, in a variety of environments. Moreover, to provide various services from different wireless communication standards with higher capacities and higher data-rates, fully integrated and multifunctional wireless devices will be required.
Multifunctional circuits and systems can be made profitable by a large scale of integration, elimination of external components, reduction of silicon area, and extensive reuse of resources. Integration of (Bi)CMOS transceiver RF front-end and analog baseband circuits with computing CMOS circuits on the same silicon chip further reduces costs of multifunctional mobile devices.
However, as batteries continue to determine the lifetime and size of mobile equipment, further extension of capabilities of wearable and wireless devices will depend critically on the integrated circuits and systems solutions.
The demand for multifunctional and multi-mode wireless-capable devices is accompanied by many significant challenges at system, circuit, and technology levels.
In Circuits and Systems for Future Generations of Wireless Communications circuit and system solutions for multiple communication standards and future generations of wireless communications are discussed.
Multifunctional circuits and systems can be made profitable by a large scale of integration, elimination of external components, reduction of silicon area, and extensive reuse of resources. Integration of (Bi)CMOS transceiver RF front-end and analog baseband circuits with computing CMOS circuits on the same silicon chip further reduces costs of multifunctional mobile devices.
However, as batteries continue to determine the lifetime and size of mobile equipment, further extension of capabilities of wearable and wireless devices will depend critically on the integrated circuits and systems solutions.
The demand for multifunctional and multi-mode wireless-capable devices is accompanied by many significant challenges at system, circuit, and technology levels.
In Circuits and Systems for Future Generations of Wireless Communications circuit and system solutions for multiple communication standards and future generations of wireless communications are discussed.
Caracteristici
Design of Adaptive Circuits and Systems (RF Circuit and Systems Designers; Students) Design of UWB Circuits and Systems (RF Circuit and System Designers; Students) Design of Multi-Standard Multi-Mode and Multi-Band Circuits and Systems (RF Circuit and Systems Designers; Students)